SK Hynix Expands Advanced Packaging Footprint with Dedicated High-Bandwidth Memory Assembly Plant
SK Hynix has broken ground on a specialized advanced packaging facility designed exclusively for next-generation High-Bandwidth Memory integration, aiming to alleviate supply constraints for AI accelerators.
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MicronMicron Technology Begins Volume Production of Next-Gen Low-Power Memory for Mobile AI Handsets
Micron Technology has initiated commercial volume shipments of its newest ultra-fast mobile memory modules, optimized to feed high-bandwidth data to generative AI models running on smartphones.
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SamsungHBM4 Memory Architecture Integrates Custom Logic Die to Support Custom AI Accelerators
Samsung Memory has detailed its upcoming HBM4 specifications, featuring a dedicated foundry-manufactured base die that replaces traditional buffer logic for enhanced bandwidth.
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TSMCEmbedded MRAM Integration Advances Non-Volatile Microcontroller Performance for Edge AI
Foundry deployment of embedded magnetoresistive random-access memory provides high-speed, non-volatile data storage with zero standby power consumption for edge artificial intelligence microcontrollers.
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