AMD
3 storiesAI ProcessorsAMD Unveils Multi-Die AI Accelerator Architecture Featuring Advanced Interposer Integration and Liquid CoolingThermal ManagementAdvanced Indium Solder Bonding Techniques Resolve High-Heat Dissipation Challenges in 1000W AI AcceleratorsThermal ManagementLiquid-Metal Thermal Interface Materials Sustain High Heat Flux in Enterprise AI Workstations
ASE Group
1 storyASML
4 storiesLithography & EquipmentASML Ships Next-Generation High-NA EUV Systems to European Research Consortiums for Sub-2nm Lithography TrialsLithography EquipmentASML Validates Carbon Nanotube Pellicles to Protect High-NA EUV Photomasks Under Extreme Thermal LoadsLithography EquipmentExtreme UV Pellicle Optimization Solves Reticle Contamination in High-Volume Sub-2nm Manufacturing
View all 4 stories →Applied Materials
4 storiesSemiconductor EquipmentApplied Materials Introduces Atomic Layer Deposition System for Gate-All-Around Transistor ManufacturingSemiconductor EquipmentAdvanced Metrology Systems Deploy In-Situ X-Ray Diffraction to Monitor Nanosheet Profile UniformitySemiconductor EquipmentExtreme UV Stochastic Inspection Tools Identify Sub-Nanometer Resist Defects Prior to Etching
View all 4 stories →Ayar Labs
1 storyBroadcom
1 storyCadence
1 storyInfineon
2 storiesIntel
9 storiesFoundry & ManufacturingIntel Foundry Secures Strategic Defense Microelectronics Partnership for Domestic Advanced PackagingSpecialized SiliconWestern Technology Consortium Develops Cryogenic CMOS Control Circuits for Quantum Computing InterconnectsAdvanced SubstratesIntel Pioneers Glass Core Substrate Pilot Line for Next-Generation Multi-Die AI Accelerators
View all 9 stories →Lam Research
3 storiesSemiconductor EquipmentAtomic Layer Etch Precision Unlocks Damage-Free Gate-All-Around Nanosheet Channel ReleaseSemiconductor EquipmentAtomic Layer Deposition Breakthrough Enables Pinpoint High-K Dielectric Uniformity on NanosheetsSemiconductor EquipmentSub-Nanometer Gate-All-Around Spacer Etch Optimization Enhances Parasitic Capacitance Control
Lasertec
1 storyMarvell
1 storyMicron
1 storyQualcomm
1 storySK Hynix
2 storiesSamsung
2 storiesSiemens EDA
1 storySynopsys
3 storiesElectronic Design AutomationSynopsys and Ansys Deliver Integrated Silicon-Photonics EDA Platform for Optical Interconnect DesignElectronic Design AutomationMulti-Die Interposer Routing Tools Accelerate Heterogeneous Integration for Enterprise AcceleratorsElectronic Design AutomationMulti-Die Thermal Simulation Engines Predict Dynamic Hotspot Formation in 2000W AI Processors
TSMC
6 storiesFoundry & ManufacturingTSMC 2nm Nanosheet Production Line Achieves Record High Initial Yields Ahead of Major Client ShipmentsSilicon PhotonicsTSMC Integrates Laser Sources Directly onto Silicon Photonics Wafers for Optical Datacenter LinksFoundry & ManufacturingBackside Power Distribution Networks Validate Sub-1.8nm Logic Scaling and Voltage Stability
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